By using a Weinai mixer,micrometer and nanoscale particles are quickly added to the carrier, ensuring that the prepared conductive adhesive has appropriate viscosity and fluidity.
2.In the process of material mixing, due to the secondary agglomeration of nanoscale fillers under the carrier coating, and the significant difference inmaterial viscosity due to different solid contents, conventional dispersion equipment is difficult to handle, requiring the use of a three roll grinder forgrinding and dispersion.
The concentration of dispersed silver particles is high, D90 can reach below 3 microns.
3.The conductive adhesive dispersed by three rollers is defoaming and encapsulated to obtain the final product for low-temperature storage.
